A portrait of copper processed by equal channel angular pressing

Materials Transactions

Volumn 49, Issue 1, 2008, Pages 31-37

  Hellmig, Ralph J ^a   Jancček, Miloš ^b   Hadzima, Branislav ^c   Gendelman, Oleg V ^d   Shapiro, Michael ^d   Molodova, Xenia ^e   Springer, André ^a   Estrin, Yuri ^f,g  

^a CLAUSTHAL UNIVERSITY OF TECHNOLOGY   (Germany)

^b CHARLES UNIVERSITY   (Czech Republic)

^c UNIVERSITY OF ILINA   (Slovakia)

^d TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^e RWTH AACHEN UNIVERSITY   (Germany)

^f MONASH UNIVERSITY   (Australia)

^g CSIRO   (Australia)

Author keywords

Copper; Corrosion behaviour; Equal channel angualar pressing; Mechanical properties; Severe plastic deformation; Thermal conductivity; Thermal stability

Indexed keywords

CORROSION RESISTANCE; ELECTRIC CONDUCTIVITY; EQUAL CHANNEL ANGULAR PRESSING; GRAIN REFINEMENT; THERMAL CONDUCTIVITY; THERMODYNAMIC STABILITY;

CORROSION BEHAVIOUR; ELECTRICAL CONNECTORS; GRAINED MICROSTRUCTURE;

COPPER;

EID: 39549122229     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.ME200717     Document Type: Article

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