Investigating mechanical properties of epoxy/organoclay nanocomposites

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Volumn 31, Issue 1, 2008, Pages 9-16

  Tsai, Jia Lin ^a   Hsu, Shin Ming ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Fracture toughness; Nanocomposites; Organoclay; Tensile strength

Indexed keywords

EPOXY RESINS; FRACTURE TOUGHNESS; MORPHOLOGY; ORGANOCLAY; SONICATION; STIFFNESS;

FAILURE STRAIN; ORGANOCLAY NANOCOMPOSITES;

NANOCOMPOSITES;

EID: 38949133112     PISSN: 02533839     EISSN: 21587299     Source Type: Journal    
DOI: 10.1080/02533839.2008.9671355     Document Type: Article

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