Morphology and performance of epoxy nanocomposites modified with organoclay and rubber

Polymer Engineering and Science

Volumn 44, Issue 6, 2004, Pages 1178-1186

  Liu, Weiping ^a   Hoa, Suong V ^a   Pugh, Martin ^a  

^a Concordia University ^*  (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CLAY; CURING; FRACTURE TOUGHNESS; HIGH TEMPERATURE EFFECTS; MORPHOLOGY; NANOSTRUCTURED MATERIALS; RUBBER; SCANNING ELECTRON MICROSCOPY; YIELD STRESS;

COMPRESSIVE MODULUS; EPOXY NANOCOMPOSITES; ORGANOCLAY; SUPERPOSITION EFFECTS;

EPOXY RESINS;

EID: 4043051558     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.20111     Document Type: Conference Paper

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