Mechanical properties and fracture behavior of epoxy nanocomposites with highly exfoliated pristine clay

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 2, Issue , 2004, Pages 1820-1824

  Wang, Ke ^a   Wu, Jingshen ^a,b   Chen, Ling ^a   He, Chaobin ^a   Toh, Meiling ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Clay; Epoxy; Fracture toughness; Mechanical property; Nanocomposite

Indexed keywords

MICROGRAPHS; NANOCOMPOSITES; POLYMER MATRIX; SINGLE-EDGE-NOTCHED (SEN);

CURING; DIFFUSION; ELASTIC MODULI; EPOXY RESINS; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILICATES; TRANSMISSION ELECTRON MICROSCOPY;

NANOSTRUCTURED MATERIALS;

EID: 2442450683     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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