Chip to system levels thermal needs and alternative thermal technologies for high brightness LEDS

Journal of Electronic Packaging

Volumn 129, Issue 3, 2007, Pages 328-338

  Arik, Mehmet ^a   Setlur, Anant ^a   Weaver, Stanton ^a   Haitko, Deborah ^a   Petroski, James ^b  

^a GENERAL ELECTRIC COMPANY   (United States)

^b GE Lumination   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; HEAT FLUX; LIGHT EMITTING DIODES; LIGHTING; PHOSPHORS; POWER CONTROL;

MONOCHROMATIC COLORS; PACKAGING ARCHITECTURES;

MICROPROCESSOR CHIPS;

EID: 38749083399     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2753958     Document Type: Article

References (14)

1. Cree, 2005, www.cree.com.
2. Lumileds, 2005, www.lumileds.com/technology.
3. Arik, M., Weaver, S., Becker, C., Hsing, M., and Srivastava, A., 2003, "Effects of Localized Heat Generations Due to The Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes," Proceedings ASME/IEEE International Electronic Packaging Technical Conference and Exhibition -InterPACK'03, Hawaii, July 6-11.
4. Garg, J., Arik, M., Weaver, S., and Saddoughi, S., 2004, "Micro Fluidic Jets for Thermal Management of Electronics," Proceedings ASME Heat Transfer and Fluids Engineering Conference, Charlotte, NC, July 11-15.
5. Arik, M., and Weaver, S., 2005, "Effect of Chip and Bonding Defects on the High Brightness LED Junction Temperatures," Opt. Eng. (Bellingham), 44(11), p. 111305.
6. Arik, M., Becker, C., Weaver, S., and Petroski, J., 2002, "Thermal Management of LEDs: Package to System," Proc. SPIE, 5187, pp. 64-75.
7. Arik, M., Petroski, J., and Weaver, S., 2002, "Thermal Challenges in the Future Generation Solid-State Lighting Applications: Light Emitting Diodes," Proceedings of the ASME/IEEE ITHERM-Conference, San Diego, May 29-June 1.
8. Petroski, J., 2003, "Thermal Challenges Facing New Generation LEDs for Lighting Applications," Proc. SPIE, 4776, pp. 215-222.
9. Petroski, J., 2004, "Spacing of High-Brightness LEDs on Metal Substrate PCB's for Proper Thermal Performance," Proceedings ITHERM, Las Vegas, June 1-4, pp. 507-514.
10. Acikalin, T., Garimella, S., Petroski, J., and Raman, A., 2004, "Optimal Design of Miniature Piezoelectric Fans for Cooling Light Emitting Diodes," Proceedings ITHERM, Las Vegas, June 1-4, pp. 663-671.
11. Acikalin, T., Garimella, S., Petroski, J., and Raman, A., 2004, "Numerical Investigation of the Flow and Heat Transfer due to a Miniature Piezoelectric Fan," IMECE 2004 Proceedings, Anaheim, CA, November 13-19, Paper No. IMECE2004-61145.
12. Garg, J., Arik, M., Weaver, S., and Saddoughi, S., 2004, "Micro Fluidic Jets for Thermal Management of Electronics," Proceedings ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, July 11-15.
13. Garg, J., Arik, M., and Weaver, S., 2005, "Impingement Air Cooling with Synthetic Jets Over Small and Large Heated Surfaces," Proceedings Inter-PACK'05 ASME Pacific Rim Technical Conference and Exhibition on Integration und Packaging of MEMS, NEMS and Electronics Systems, IPACK2005-73211, San Francisco, CA, July 17-22.
14. Garg, J., Arik, M., Weaver, S., Wetzel, T., and Saddoughi, S., 2005, "Advanced Localized Air Cooling with Synthetic Jets," ASME J. Electron. Packag., 127, pp. 503-511.