Improved dispersion of aluminum nitride particles in epoxy resin by adsorption of two-layer surfactants

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 316, Issue 1-3, 2008, Pages 95-103

  Lee, Eun Sung ^a   Lee, Sang Mock ^b   Cannon, W Roger ^a   Shanefield, Daniel J ^a  

^a Piscataway   (United States)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Aluminum nitride; Dispersion; Epoxy resin; Silane coupling agent

Indexed keywords

ADSORPTION; COUPLING AGENTS; EPOXY RESINS; POLYMERIZATION; SURFACE ACTIVE AGENTS; THERMAL CONDUCTIVITY; VISCOSITY;

ALUMINUM NITRIDE; SILANE COUPLING AGENT; VISCOSITY REDUCTION;

ALUMINUM COMPOUNDS;

ALUMINUM NITRATE; ALUMINUM OXIDE; CARBOXYLIC ACID; EPOXIDE; RESIN; SILANE; SURFACTANT;

ADSORPTION; ARTICLE; DISPERSION; POLYMERIZATION; PRIORITY JOURNAL; THERMAL CONDUCTIVITY; VISCOSITY;

EID: 38649122684     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2007.08.045     Document Type: Article

References (34)

1. Tummala R.R., and Rymaszewski EJ. Microelectronic Packaging Handbook (1989), Van Nostrand Reinhold, Princeton pp. 727-777
2. Bujard P., Kuhnlein G., Ino S., and Shiobara T. Thermal conductivity of molding compounds for plastic packaging. IEEE Transactions on Components. Pack. Manuf. Technol. A 17 4 (1994) 527-532
3. Wong C.P., and Bollampally R.S. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging. J. Appl. Polym. Sci. 74 (1999) 3396-3403
4. Nagai Y., and Lai G.C. Thermal conductivity of epoxy resin filled with particulate aluminum nitride powder. J. Ceram. Soc. Jpn. 105 3 (1997) 197-200
5. Koh W.H. High thermal conductance liquid encapsulants for direct chip attach. Proceedings of the Electronic Components and Technology Conference. IEEE, Piscataway, NJ (1996) 343-346
6. Hill R.F., and Supancic P.H. Thermal conductivity of platelet-filled polymer composites. J. Am. Ceram. Soc. 85 4 (2002) 851-857
7. ® Technology Report, Loctite/Henkel Corporation, Rocky Hill, CT, 2001, pp. 4-8.
8. Kitahara K. Stability of dispersions in polar media. Adv. Colloid Interf. Sci. 38 (1992) 1-11
9. Lyklema J. Principles of the stability of lyophobic colloidal dispersions in nonaqueous media. Adv. Colloid Interf. Sci. 2 (1968) 65-114
10. Raj P.M., and Cannon W.R. Electrosteric stabilization mechanisms in nonaqueous high solids loading dispersions. In: Hackley V.A., Somasundaran P., and Lewis J.A. (Eds). Polymers in Particulate Systems (2002), Marcel Dekker, New York 27-62
11. Horn R.G. Surface forces and their action in ceramic materials. J. Am. Ceram. Soc. 73 5 (1990) 1117-1135
12. Kinloch A.J. Structural Adhesives: Developments in Resins and Primers (1986), Elsevier, New York
13. Ooij W.J., and Child T. Protecting metals with silane coupling agents. Chemtech 2 (1998) 26-36
14. Ulman A. An Introduction to Ultrathin Organic Films (1997), Elsevier, Amsterdam pp. 237-340
15. 3 and its effect on dispersibility. J. Mater. Sci. 23 (1988) 1729-1734
16. Plueddemann E.P., and Stark G.L. Viscosities of Filled Resins (1978), Academic Press, New York pp. 49-61
17. Dinger D.R. Rheology for Ceramists. Dinger Ceramic Consulting Services (2002), Clemson, South Carolina
18. Ivanov P.V. Replicative Synthesis. Polym. Sci. A 37 (1995) 266
19. McNeil K.J., DiCaprio J.A., Walsh D.A., and Pratt R.F. Kinetics and mechanism of hydrolysis of a silicate triester. J. Am. Chem. Soc. 102 (1980) 1859
20. Mishra S., and Weimer J.J. Effects of curing, washing, and pre-oxidation on the bonding of monofunctioal silanes to polished copper surfaces. J. Adhes. Sci. Technol. 11 3 (1997) 337-357
21. Baraton M.I., Chen X., and Gonsalves K.E. FTIR analysis of the surface of nanostructured aluminum nitride powder prepared via chemical synthesis. J. Mater. Chem. 6 (1996) 1407
22. 2, and acetic acid adsorptions. Nanostruct. Mater. 8 4 (1997) 435-445
23. In: Lide D.R., et al. (Ed). Handbook of Chem. and Phys (1999), CRC Press, New York
24. Solomons G., and Fryhle C. Organic Chemistry. 7th ed. (2000), John Wiley, New York pp. 55-58
25. Shimizu Y., Kawanabe K., Taki Y., Takao Y., and Egashira M. AlN ceramics prepared by aqueous colloidal processing. Ceram. Trans. 51 (1995) 403-407
26. Neville K. Handbook of Epoxy Resins (1967), McGraw-Hill, New York
27. Nilsen K.J., Riman R.E., and Danforth S.C. The effect of moisture on the surface chemistry and dispersion properties of silicon nitride in imidazoline-hexane solutions. Ceram. Trans. A 1 (1988) 469
28. Wang L., Sigmund W., and Aldinger F. Systematic approach for dispersion of silicon nitride powder in organic media. J. Am. Ceram. Soc. 83 4 (2000) 697-702
29. Ogitani S., Silverstrov V.G., Kohl P.A., and Allen S.A.B. Development of a ceramic/epoxy composite for integral capacitors. Int. J. Microcircuits Electron. Pack. 23 4 (2000) 367-377
30. Okuyama M., Garvey G.J., Ring T.A., and Haggerty J.S. Dispersion of silicon carbide powders in nonaqueous solvents. J. Am. Ceram. Soc. 72 (1989) 1918-1924
31. Fowkes F.M., and Mostafa M.A. Acid-base interactions in polymer adsorption. Ind. Eng. Chem. Prod. Res. Dev. 17 1 (1978) 3-7
32. Burrell H. Pigment wetting and dispersion parameters. Proc. Am. Chem. Soc. Plastic Coat. Div. 35 2 (1975) 18-25
33. Shanefield D.J. Organic Additives and Ceramic Processing. 2nd ed. (1996), Kluwer Academic Publishers, Boston pp. 240-246
34. Plueddemann E.P. Silane Coupling Agents (1991), Plenum Press, Boston