Effects of curing, washing, and pre-oxidation on the bonding of monofunctional silanes to polished copper surfaces

Journal of Adhesion Science and Technology

Volumn 11, Issue 3, 1997, Pages 337-357

  Mishra, S ^a   Weimer, J J ^a  

^a UNIVERSITY OF ALABAMA IN HUNTSVILLE   (United States)

Author keywords

Cu; Metal oxides; Silane; Siloxane; Silylation; XPS

Indexed keywords

BONDING; COPPER; CURING; HYDROGEN BONDS; OXIDATION; OXIDES; SILANES; STABILITY; SURFACES; WASHING; X RAY PHOTOELECTRON SPECTROSCOPY; BEHAVIORAL RESEARCH; CHLORINE COMPOUNDS; LEAD OXIDE; SILICON; SILICON COMPOUNDS; SURFACE REACTIONS;

CHLOROSILANE; METAL OXIDES; METHOXYSILANE; SILOXANE; SILYLATION;

ADHESION; SILANES;

CHLOROSILANES; COPPER SURFACE; CU SURFACES; HIGH TEMPERATURE; HYDROXYL GROUPS; IN-VACUUM; METAL OXIDES; METHOXYSILANE; MONOFUNCTIONAL SILANES; PRE-OXIDATION; PRE-OXIDIZED; SILANE LAYERS; SILANOLS; SILOXANE; SILYLATIONS; SURFACE OXIDE; TRIMETHYLCHLOROSILANES;

EID: 0030705236     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856197X00741     Document Type: Article

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