Effect of wettability of poly silicon on CMP behavior

Materials Research Society Symposium Proceedings

Volumn 991, Issue , 2007, Pages 275-280

  Kang, Young Jae ^a   Kang, Bong Kyun ^a   Kim, In Kwon ^a   Park, Jin Goo ^a   Hong, Yi Koan ^b   Han, Sang Yeob ^b   Yun, Seong Kyu ^b   Yoon, Bo Un ^b   Hong, Chang Ki ^b  

^a Hanyang University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; HYDROPHOBICITY; SILICON WAFERS; WETTING;

ADHESION FORCE; POLISHING RATES; POLYMERIC PARTICLES;

POLYSILICON;

EID: 38549147447     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0991-c09-06     Document Type: Conference Paper

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