A novel planarization process for polysilicon sacrificial layers in a micro-thermal system

Sensors and Actuators, A: Physical

Volumn 108, Issue 1-3, 2003, Pages 86-90

  Chen, H R ^a   Gau, C ^a   Dai, B T ^b   Tsai, M S ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

CMP; Planarization process

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DEPOSITION; ETCHING; THERMAL INSULATION; THIN FILM CIRCUITS; THIN FILM TRANSISTORS; THIN FILMS;

MICRO-THERMAL SYSTEMS;

POLYSILICON;

EID: 0344945473     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.04.002     Document Type: Conference Paper

References (6)

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