Contrast enhancement materials for thick photoresist applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5376, Issue PART 2, 2004, Pages 1190-1205

  Flack, Warren W ^a   Nguyen, Ha Ai ^a   Buchanan, Jim ^a   Capsuto, Elliott ^b   Marks, Alan ^b  

^a Ultratech Stepper Inc   (United States)

^b SHIN ETSU CHEMICAL CO LTD   (Japan)

Author keywords

Advanced packaging; Aspect ratios; BCB; CEM; Contrast enhancement material; Flipchip; MEMS; Thick photoresist

Indexed keywords

ADVANCED PACKAGING; BCB; CONTRAST ENHANCEMENT MATERIALS (CEM); THICK PHOTORESISTS;

ASPECT RATIO; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROELECTROMECHANICAL DEVICES; SCANNING ELECTRON MICROSCOPY; THICK FILMS;

PHOTORESISTS;

EID: 3843133947     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.556842     Document Type: Conference Paper

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