New IC packages really pack in the leads

EDN

Volumn 42, Issue 18, 1997, Pages 93-X1

  Lipman, Jim ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3843054631     PISSN: 00127515     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. Newberry, William, "Design Techniques for Ball Grid Arrays," PCB Design Conference West Proceedings, March 1997, pg 349.
2. Trefethen, Dean, "Introduction to Design With Ball Grid Arrays," PCB Design Conference West Proceedings, March 1997, pg 131.
3. Bauer, Charles, "The Future of BGA," Advanced Packaging, January/ February 1997, pg 8.
4. DeJule, Ruth, "High Pincount Packaging," Semiconductor Intemational, July 1997, pg 139.
5. Ray, SK, H Quinones, S Iruvanti, E Atwood, and L Walls, "Ceramic Column Grid Array (CCGA) Module for a High Performance Workstation Application," Electronic Component Technology Conference (ECTC) Proceedings, May 1997, pg 319.