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Volumn 20, Issue 8, 1997, Pages 139-140,-142,-144,-146
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High pincount packaging
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT MANUFACTURE;
PHOTOLITHOGRAPHY;
PLASTICS APPLICATIONS;
SURFACE MOUNT TECHNOLOGY;
THERMAL EXPANSION;
BALL GRID ARRAYS;
CHIP SCALE PACKAGES;
THERMALLY ENHANCED PACKAGES;
ELECTRONICS PACKAGING;
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EID: 0031186262
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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