Resistance to thermo-mechanical stress of different coupling agents used as intermediate layer in resin-fiber post bonds

American Journal of Dentistry

Volumn 20, Issue 6, 2007, Pages 416-420

  Monticelli, Francesca ^a,b   Osorio, Raquel ^b   Tay, Franklin R ^c   Sadek, Fernanda T ^d   Ferrari, Marco ^a   Toledano, Manuel ^b  

^a UNIVERSITY OF SIENA   (Italy)

^b UNIVERSITY OF GRANADA   (Spain)

^c MEDICAL COLLEGE OF GEORGIA   (United States)

^d UNIVERSITY OF SÃO PAULO   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

CLEARFIL AP X; CLEARFIL AP-X; CLEARFIL PORCELAIN BOND; CLEARFIL S3 BOND; CLEARFIL SE BOND; DENTIN BONDING AGENT; EPOXY RESIN; HYDROGEN PEROXIDE; METHACRYLIC ACID DERIVATIVE; MONOBOND S; OXIDIZING AGENT; RESIN CEMENT; SILANE DERIVATIVE; SILICON DIOXIDE; TOOTH CEMENT; UNCLASSIFIED DRUG;

ARTICLE; CHEMISTRY; DENTAL BONDING; DENTAL ETCHING; DENTAL SURGERY; HUMAN; INSTRUMENTATION; MATERIALS TESTING; MECHANICAL STRESS; METHODOLOGY; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY; TEMPERATURE; TENSILE STRENGTH; TIME; TOOTH CROWN;

DENTAL BONDING; DENTAL CEMENTS; DENTAL ETCHING; DENTAL RESTORATION FAILURE; DENTIN-BONDING AGENTS; EPOXY RESINS; HUMANS; HYDROGEN PEROXIDE; MATERIALS TESTING; METHACRYLATES; MICROSCOPY, ELECTRON, SCANNING; OXIDANTS; POST AND CORE TECHNIQUE; QUARTZ; RESIN CEMENTS; SILANES; STRESS, MECHANICAL; SURFACE PROPERTIES; TEMPERATURE; TENSILE STRENGTH; TIME FACTORS;

EID: 38349149836     PISSN: 08948275     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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