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Volumn 34, Issue 3, 2008, Pages 2111-2119

Takagi-Sugeno neural fuzzy modeling approach to fluid dispensing for electronic packaging

Author keywords

Fluid dispensing; Process modeling; Takagi Sugeno neural fuzzy systems

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; MATHEMATICAL MODELS; NEURAL NETWORKS; REGRESSION ANALYSIS; SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 37349107286     PISSN: 09574174     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eswa.2007.02.035     Document Type: Article
Times cited : (18)

References (14)
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    • Chen, D. X. (2002). Modeling and off-line control of fluid dispending for electronic packaging. PhD Thesis, The University of Saskatchewan, Canada.
  • 2
    • 0034153033 scopus 로고    scopus 로고
    • A constrained Takagi-Sugeno fuzzy system that allows for better interpretation and analysis
    • Fiordaliso A. A constrained Takagi-Sugeno fuzzy system that allows for better interpretation and analysis. Fuzzy Sets and Systems 118 (2001) 307-318
    • (2001) Fuzzy Sets and Systems , vol.118 , pp. 307-318
    • Fiordaliso, A.1
  • 5
    • 0344035526 scopus 로고    scopus 로고
    • Process modeling of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals
    • Ip K.W., Kwong C.K., Bai H., and Tsim Y.C. Process modeling of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals. International Journal of Advanced Manufacturing Technology 22 (2003) 417-423
    • (2003) International Journal of Advanced Manufacturing Technology , vol.22 , pp. 417-423
    • Ip, K.W.1    Kwong, C.K.2    Bai, H.3    Tsim, Y.C.4
  • 6
    • 37349050059 scopus 로고    scopus 로고
    • Kam, K. K. (1998). A Supervisory system for epoxy dispensing process monitoring in die bonding. MSc Dissertation, The Hong Kong Polytechnic University.
  • 7
    • 0027558438 scopus 로고
    • Physical and fuzzy logic modeling of a flip-chip thermocompression bonding process
    • Kang S.Y., Xie H., and Lee Y.C. Physical and fuzzy logic modeling of a flip-chip thermocompression bonding process. Journal of Electronic Packaging 115 (1993) 63-70
    • (1993) Journal of Electronic Packaging , vol.115 , pp. 63-70
    • Kang, S.Y.1    Xie, H.2    Lee, Y.C.3
  • 8
    • 27744443510 scopus 로고    scopus 로고
    • Fuzzy regression approach to process modeling and optimization of epoxy dispensing
    • Kwong C.K., and Bai H. Fuzzy regression approach to process modeling and optimization of epoxy dispensing. International Journal of Production Research 43 12 (2005) 2359-2375
    • (2005) International Journal of Production Research , vol.43 , Issue.12 , pp. 2359-2375
    • Kwong, C.K.1    Bai, H.2
  • 9
    • 37349012997 scopus 로고    scopus 로고
    • Kwong, C. K., Chan, K. Y., & Wong, H. (in press). An empirical approach to modeling fluid dispensing for electronic packaging. International Journal of Advanced Manufacturing Technology.
  • 11
    • 14844286166 scopus 로고    scopus 로고
    • Li, J., & Deng, G. (2004). Technology development and basic theory study of fluid dispensing - a review. In Proceedings of the sixth IEEE CPMT conference (pp. 198-205).
  • 12
    • 0021892282 scopus 로고
    • Fuzzy identification of systems and its application to modeling and control
    • Takagi T., and Sugeno M. Fuzzy identification of systems and its application to modeling and control. IEEE Transactions on Systems, Man and Cybernetics 15 1 (1985) 116-132
    • (1985) IEEE Transactions on Systems, Man and Cybernetics , vol.15 , Issue.1 , pp. 116-132
    • Takagi, T.1    Sugeno, M.2
  • 14
    • 0032115877 scopus 로고    scopus 로고
    • General MISO Takagi-Sugeno fuzzy systems with simplified linear rule consequent as universal approximators for control and modeling applications
    • Ying H. General MISO Takagi-Sugeno fuzzy systems with simplified linear rule consequent as universal approximators for control and modeling applications. Information Sciences 108 1-4 (1998) 91-107
    • (1998) Information Sciences , vol.108 , Issue.1-4 , pp. 91-107
    • Ying, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.