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Volumn 23, Issue 8, 2007, Pages 961-971

Application of the mixed-field-environments concept in lifetime prediction of some ceramic components

Author keywords

Acceleration factor; Ceramic; CLLCC; Lifetime prediction; Mixture of distributions; Thermal cycling; Use environment

Indexed keywords

ACCELERATION; ENVIRONMENTAL IMPACT; FINITE ELEMENT METHOD; THERMAL CYCLING;

EID: 37249043821     PISSN: 07488017     EISSN: 10991638     Source Type: Journal    
DOI: 10.1002/qre.846     Document Type: Article
Times cited : (2)

References (15)
  • 1
    • 8344257305 scopus 로고    scopus 로고
    • Solder reliability solutions: A PC-based design-for- reliability tool
    • SMTA: Edina, MN
    • Clech J-P. Solder reliability solutions: A PC-based design-for- reliability tool. SMTA International Proceedings 1996. SMTA: Edina, MN, 1996.
    • (1996) SMTA International Proceedings 1996
    • Clech, J.-P.1
  • 2
    • 0032641929 scopus 로고    scopus 로고
    • Are we over-designing for solder joint reliability?-Field vs. accelerated conditions, realistic vs. specified requirements
    • San Diego, CA, IEEE Press: Piscataway, NJ
    • Syed A, Doty M. Are we over-designing for solder joint reliability?-Field vs. accelerated conditions, realistic vs. specified requirements. Proceedings of the 49th Electronics Components and Technology Conference, San Diego, CA, 1999. IEEE Press: Piscataway, NJ, 1999; 111-117.
    • (1999) Proceedings of the 49th Electronics Components and Technology Conference , pp. 111-117
    • Syed, A.1    Doty, M.2
  • 3
    • 0037261723 scopus 로고    scopus 로고
    • Reliability prediction of substitute parts based on component temperature rating and limited accelerated test data
    • Tampa, FL, IEEE Press: Piscataway, NJ
    • Kleyner A, Boyle J. Reliability prediction of substitute parts based on component temperature rating and limited accelerated test data. Proceedings of the Annual Reliability and Maintainability Symposium, Tampa, FL, 2003. IEEE Press: Piscataway, NJ, 2003; 518-522.
    • (2003) Proceedings of the Annual Reliability and Maintainability Symposium , pp. 518-522
    • Kleyner, A.1    Boyle, J.2
  • 4
    • 33845590827 scopus 로고    scopus 로고
    • Analysis of acceleration factors used to predict BGA solder joint field life
    • Chicago, IL, SMTA: Edina, MN
    • Galloway J, Li L, Dunne R, Tsubaki H. Analysis of acceleration factors used to predict BGA solder joint field life. SMTA International Proceedings 2001, Chicago, IL, 2001. SMTA: Edina, MN, 2001; 357-363.
    • (2001) SMTA International Proceedings 2001 , pp. 357-363
    • Galloway, J.1    Li, L.2    Dunne, R.3    Tsubaki, H.4
  • 5
    • 37249037045 scopus 로고    scopus 로고
    • Salmela O, Särkkä J, Andersson K, Tammenmaa M. Reliability testing of some ceramic components and evaluation of the results using test interpretation tool. Proceedings of the European Microelectronics and Packaging Symposium, Prague, June 2004. IMAPS CZ&SZ Chapter: Lanskroun, Czech Republic, 2004.
    • Salmela O, Särkkä J, Andersson K, Tammenmaa M. Reliability testing of some ceramic components and evaluation of the results using test interpretation tool. Proceedings of the European Microelectronics and Packaging Symposium, Prague, June 2004. IMAPS CZ&SZ Chapter: Lanskroun, Czech Republic, 2004.
  • 9
    • 0034479828 scopus 로고    scopus 로고
    • Effect of simulation methodology on solder joint crack growth correlation
    • Las Vegas, NV, IEEE Press: Piscataway, NJ
    • Darveaux R. Effect of simulation methodology on solder joint crack growth correlation. Proceedings of the 50th Electronics Components and Technology Conference, Las Vegas, NV, 2000. IEEE Press: Piscataway, NJ, 2000; 1048-1058.
    • (2000) Proceedings of the 50th Electronics Components and Technology Conference , pp. 1048-1058
    • Darveaux, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.