Processing and dielectric properties of nanocomposite thin film "supercapacitors" for high-frequency embedded decoupling

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 569-578

  Raj, P Markondeya ^a   Balaraman, Devarajan ^b   Govind, Vinu ^c   Abothu, Isaac Robin ^a   Wan, Lixi ^d   Gerhardt, Rosario ^a   Swaminathan, Madhavan ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b INTEL CORPORATION   (United States)

^c Jacket Micro Devices Inc   (United States)

^d INSTITUTE OF MICROELECTRONICS   (China)

Author keywords

Integrated circuit (IC); Integrated circuits; Nanostructured materials; Printed circuits; Printed wiring board (PWB)

Indexed keywords

CAPACITORS; CARBON BLACK; DIELECTRIC PROPERTIES; POLARIZATION; PRINTED CIRCUIT BOARDS; THIN FILMS;

CERAMIC-POLYMER COMPOSITES; HIGH-FREQUENCY EMBEDDED DECOUPLING; NANOSTRUCTURED ELECTRODES;

NANOSTRUCTURED MATERIALS;

EID: 36849040465     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.901736     Document Type: Conference Paper

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