Thermal management of high heat flux nanoelectronic chips

Microgravity Science and Technology

Volumn 19, Issue 3-4, 2007, Pages 48-52

  Bar Cohen, A ^a   Wang, P ^a   Rahim, E ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LIQUIDS; EVAPORATION; HEAT FLUX; MICROPROCESSOR CHIPS; NANOCRYSTALLINE SILICON; TEMPERATURE CONTROL;

MOORE'S LAW; NANOELECTRONIC CHIPS; SUB-MILLIMETER ZONES; THIN FILM EVAPORATION;

NANOELECTRONICS;

EID: 36549016600     PISSN: 09380108     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02915748     Document Type: Conference Paper

References (16)

1. iNEMI, Electronics Manufacturing Initiative Technology Roadmap, 2006, http://www.nemi.org
2. Sherwood, G. and Cray, S., 1992, "Gas-liquid forced turbulence cooling", US patent 5131233.
3. Hetsroni, G., 1982, Handbook of Multi-Phase Systems, 2:30-2:40, McGraw Hill.
4. th International Heat Transfer Conference, Jerusalem, Israel, 237-254.
5. Yang, Y., Fujita, Y., 2004, "Flow boiling heat transfer and flow pattern in rectangular channel of mini-gap", Second International Conference on Microchannels and Minichannels (ICMM2004-2383), New York, USA.
6. th International Conference on Nanochannels, Microchannels and Minichannels, Limerick, Ireland.
7. Bar-Cohen, A., Sherwood, G., Hodes, M., and Solbreken, G., 1995, "Gas-Assisted Evaporative Cooling of High Density Electronic Modules," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol 18, No. 3, pp 502-509.
8. Bar-Cohen, A. and Solbreken, G., 1995, "Gas-Assisted Evaporative Cooling in a Narrow Channel", Proceedings of the Engineering Foundation Conference, Convective Flow Boiling, Banff, Canada, May 1995.
9. Solbreken, G. and Bar-Cohen, A., 1995, "Gas-Assisted Evaporative Water Cooling of High Flux Surfaces," Proceedings of the 30th National Heat Transfer Conference - Vol 2, ASME Publication HTD-Vol 304, pp 91-100.
10. Baroczy, C. J., "Correlation of liquid fraction in two-phase flow with applications to liquid metals", Chem. Eng. Prog. Symp. Ser., Vol. 61, No. 57, pp. 179-191, 1965.
11. Chen, J. C., 1996, "Correlation for Boiling Heat Transfer to Saturated Fluids in Convective Flow", Industrial an Engineering Chemistry - Process Design and Development, Vol. 5, No. 3, 322-329.
12. Kabov, O., "Cooling of Microelectronics by Thin Liquid Films," Keynote Lecture, Proceedings International Workshop on Wave Dynamics and Stability of Thin Film Flow Systems, China India, Narosa Publishing House, pp 279-311, 2006
13. Shakouri, A., and Yan Zhang; "On-chip solid-state cooling for integrated circuits using thin-film microrefrigerators", IEEE Transactions on Components and Packaging Technologies, Part A: vol. 28, no.1, pp. 65-69, 2005.
14. Wang, P., Bar-Cohen, A., Yang, B., "Enhanced Thermoelectric Cooler for On-Chip Hot Spot Cooling", Proceedings of IPACK2007, July 8-12, 2007, Vancouver, British Columbia, Canada
15. Mahajan, R., Chiu, C., andPrasher, R., "Thermal Interface Materials: A Brief Review of Design Characteristics and Materials", Electronics Cooling, vol.10, no.1, 2004.
16. Wang, P., Bar-Cohen, A., Yang, B., Solbrekken, G., Shakouri, A., 2006, "Analytical Modeling of Silicon Thermoelectric Microcooler", Journal of Applied Physics, Vol. 100, Issue 1, Published online July 6, 2006.