Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 15, Issue 4, 2005, Pages 807-812

  Huang, Chun Yue ^a,b   Wu, Zhao Hua ^b   Huang, Hong Yan ^b   Zhou, De Jian ^b  

^a XIDIAN UNIVERSITY   (China)

^b GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

Author keywords

Fine pitch; Nonlinear finite element analysis; Solder joint shape; Thermal fatigue life

Indexed keywords

CRACK PROPAGATION; CRACKS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD; STRAIN; STRESS CONCENTRATION; THERMAL CYCLING;

FINE PITCH; PLASTIC STRAIN RANGE; QUAD FLAT PACKAGE (QFP); STRAIN DISTRIBUTION; STRESS DISTRIBUTION; THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 25844465894     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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