Microstructure and mechanical properties of diffusion bonded joints between titanium and stainless steel with copper interlayer

Science and Technology of Welding and Joining

Volumn 12, Issue 7, 2007, Pages 572-578

  Kundu, S ^a   Chatterjee, S ^a  

^a INDIAN INSTITUTE OF ENGINEERING SCIENCE AND TECHNOLOGY   (India)

Author keywords

Diffusion bonding; Electron probe microanalysis; Interlayer; Intermetallic compounds; X ray diffraction technique

Indexed keywords

EID: 36448959440     PISSN: 13621718     EISSN: 13621718     Source Type: Journal    
DOI: 10.1179/174329307X227229     Document Type: Article

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