Strength of the Diffusion Bonded Joints between CP Ti and 304 Stainless Steel Processed below and above β-Transus

ISIJ International

Volumn 44, Issue 2, 2004, Pages 388-395

  Ghosh, M ^a   Bhanumurthy, K ^b   Kale, G B ^b   Krishnan, J ^b   Chatterjee, S ^a  

^a INDIAN INSTITUTE OF ENGINEERING SCIENCE AND TECHNOLOGY   (India)

^b BHABHA ATOMIC RESEARCH CENTRE   (India)

Author keywords

Diffusion bonding; Intermetallic compounds; Uphill diffusion; transus

Indexed keywords

BONDING; COMPOSITION; DIFFUSION; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; TENSILE TESTING; VACUUM; X RAY DIFFRACTION ANALYSIS;

DIFFUSION BONDING; UPHILL DIFFUSION; Β-TRANSUS;

TITANIUM;

EID: 1942441692     PISSN: 09151559     EISSN: None     Source Type: Journal    
DOI: 10.2355/isijinternational.44.388     Document Type: Article

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