A mechanistic model for copper electropolishing in phosphoric acid

Journal of the Electrochemical Society

Volumn 155, Issue 1, 2008, Pages

  Mendez, Julie ^a,c   Akolkar, Rohan ^b,c   Andryushchenko, Tatyana ^b,c   Landau, Uziel ^a,c  

^a Case Western Reserve University   (United States)

^b INTEL CORPORATION   (United States)

^c ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ELECTROPOLISHING PROCESS; CUPRIC ION CONCENTRATION; DIFFUSION PROCESS; PROCESS CONDITIONS;

ANODES; DIFFUSION; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTROLYTIC POLISHING; FILM THICKNESS; THIN FILMS;

PHOSPHORIC ACID;

EID: 36448946587     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2801396     Document Type: Article

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