Stacked silicon CMOS circuits with a 40-Mb/s through-silicon optical interconnect

IEEE Photonics Technology Letters

Volumn 10, Issue 3, 1998, Pages 606-608

  Vendier, Olivier ^a,c   Bond, Steven W ^a,c   Lee, Myunghee ^a   Jung, Sungyung ^a,c   Brooke, Martin ^a,c   Jokerst, Nan Marie ^a,c   Leavitt, Richard P ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b U S ARMY RESEARCH LABORATORY   (United States)

^c IEEE   (United States)

Author keywords

3 D systems; Integrated optoelectronics; Interconnections; Optical

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED OPTOELECTRONICS; LIGHT EMITTING DIODES; MICROPROCESSOR CHIPS; OPTICAL COMMUNICATION; PHOTODETECTORS; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTING SILICON; SEMICONDUCTOR METAL BOUNDARIES; THIN FILM DEVICES;

STACKED SILICON CIRCUITS;

OPTICAL INTERCONNECTS;

EID: 3643048870     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

1. A. Iwata and I. Hayashi, "Optical Interconnections as a new LSI technology," IEICE Trans. Electron., vol. E76-C, no. 1, pp. 90-99, 1992.
2. S. Tang and R. Chen, "1-27 highly parallel three-dimensional intra and inter board optical interconnects," IEEE Photon. Technol. Lett., vol. 6, pp. 299-301, Feb. 1994.
3. J. W. Goodman and F. J. Leonberger, "Optical interconnection for VLSI systems," Proc. IEEE, vol. 72, pp. 850-866, 1984.
4. D. S. Wills, J. M. Baker, H. H. Cat, S. M. Chai, L. Codrescu, J. Cruz-Rivera, J. Eble, A. Gentile, M. Hopper, W. S. Lacy, A. Lopez-Lagunas, P. May, S. Smith, and T. Taha, "Processing architectures for smart pixel systems," IEEE J. Select. Topics Quantum Electron., vol. 2, pp. 24-34, June 1996.
5. M. Koyanagi, H. Takata, H. Okano, and S. Yokoyama, "Three-dimensional memory LSI with optical interconnections," Electron. Commun. Jpn., Pt. 2, vol. 76, no. 2, pp. 1-13, 1993.
6. R. F. Carson, M. L. Lovejoy, K. L. Lear, M. E. Warren, P. K. Seigal, G. A. Patrizi, S. P. Kilcoyne, and D. C. Craft, "Low-power modular parallel photonic data links," in 1996 IEEE ECTC Proc., pp. 321-326.
7. N. M. Jokerst, C. Camperi-Ginestet, B. Buchanan, S. Wilkinson, and M. A. Brooke, "Communication through stacked silicon circuitry using integrated thin film InP-based emitters and detectors," IEEE Photon. Technol. Lett., vol. 7, pp. 1028-1030, Sept. 1995.
8. S. W. Bond, M. Lee, J. J. Chang, O. Vendier, Z. Hou, M. Brooke, N. M. Jokerst, and R. P. Leavitt, "An integrated 155 Mbps digital transmitter using a 1.3 μm wavelength thin film LED," Proc. IEEE LEOS Annu. Meet. '96, vol. 1, 1996, pp. 342-343.
9. R. P. Jindal, "Gigahertz-band high-gain low-noise AGC amplifiers in fine-line NMOS," IEEE J. Solid-State Circuits, vol. SSC-22, no. 4, pp. 512-521, 1987.
10. O. Vendier, N. M. Jokerst, and R. P. Leavitt, "Thin film inverted MSM photodetectors," IEEE Photon. Technol. Lett., vol. 8, pp. 266-268, Aug. 1996.
11. M. Lee, O. Vendier, Martin A. Brooke, and N. M. Jokerst, "A scalable CMOS current mode preamplifier design for an optical receiver," Analog Integrated Circuits and Signal Processing, vol. 12, no. 2, pp. 133-144, 1997.