Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Zhu, W H ^a   Li, Guang ^b   Sun, Wei ^a   Che, F X ^a   Sun, Anthony ^a   Wang, C K ^a   Tan, H B ^a   Zhao, B Z ^b   Chin, N H ^b  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b Cookson Semiconductor Packaging Materials ^*  (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CORRELATION METHODS; ELECTROMAGNETIC COMPATIBILITY; MATHEMATICAL MODELS; MEASUREMENT THEORY; TRANSFER MOLDING;

CURE SHRINKAGE; MOLDING TEMPERATURE; WARPAGE;

SHRINKAGE;

EID: 36348956188     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.359966     Document Type: Conference Paper

References (10)

1. Kiyoshi Miyaki, " Thermal-viseoelastic analysis for warpage of ball grid arrange packages taking into consideration of chemical shrinkage of molding compound", Journal of Japanese Electronics Society, Vol.7(1), 2004, pp.54-61.
2. Gerard Kelly, Colin Lyden,et al, "Importance of molding compound cure shrinkage in the stress and warpage analysis of PQFP's", IEEE Transactions on Components, Packaging, and Manufacturing Technology, -Part B, Vol. 19(2), 1996, pp.296-300.
3. Ken Oota and Masumi Saka, "Cure Shrinkage Analysis of Epoxy Molding Compound," Polymer Engineering and Science, August 2001, Vol. 41, pp. 1373-1379.
4. M. Ogata, Noriyuki Kinjo, et al, " Effect of curing acceleratiors on Physical propertiesof Expoxy Molding Compound", Journal of Applied Polymer Science, Vol. 44, 1992, pp. 1795-1805.
5. M. Ogata, S.Eguich, T. Ishi and T. Kawada, " Cross-linking effects to cured properties of phenol novolac epoxy resin", Journal of Thermosettiing Plastics, 1999.
6. Sindee L Simon, Gregory B. Mckenna, Oliver Sindi, " Modeling the evolution of the dynamic mechanical properties of a commercial epoxy during cure after gelation".
7. Timoshenko, S.P., "Strength of materials", 1955, Pt. 1, Third Edition, Mc Graw Hill Publishers, New York
8. Timoshenko, S.P., "Theory of elasticity", 1951, Mc Graw Hill Publishers, New York.
9. Ernst, L.J., et al. (2006) "Fully Cure-Dependent Modelling and Characterization of EMCs with Application to Package Warpage Simulation", in: Proc. Of IEEE CPMT Int. Symp. on Advance Packaging Materials 2006, Atlanta, March 2006.
10. 10.Yang, D. G., Jansen, K. M.B., Wang, L.G., Ernst, L.J., et al, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 27, 2004, 676-683.