Dynamic capacity modeling in semiconductor assembly manufacturing

International Journal of Production Research

Volumn 46, Issue 3, 2008, Pages 739-752

  Zhang, M Tao ^a   Fu, J ^b   Zhu, E ^c  

^a INTEL CORPORATION   (United States)

^b Alcatel Shanghai Bell Co Ltd   (China)

^c INTEL CORPORATION   (China)

Author keywords

Capacity modeling; Joint protective capacity (JPC); Re entrant flow; Semiconductor manufacturing; Theory of constraints (TOC)

Indexed keywords

COMPETITION; CONSTRAINT THEORY; MATHEMATICAL MODELS; PRODUCTION ENGINEERING;

CAPACITY MODELING; JOINT PROTECTIVE CAPACITY (JPC); RE-ENTRANT FLOW; SEMICONDUCTOR MANUFACTURING; THEORY OF CONSTRAINTS (TOC);

SEMICONDUCTOR MATERIALS;

EID: 36248987688     PISSN: 00207543     EISSN: 1366588X     Source Type: Journal    
DOI: 10.1080/00207540600932020     Document Type: Article

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