Via/hole filling by pulse-reverse copper electroplating for 3D SiP

Materials Science Forum

Volumn 510-511, Issue , 2006, Pages 942-945

  Chang, Gun Ho ^a   Chang, Si Young ^b   Lee, Jae Ho ^a  

^a Hong Ik University   (South Korea)

^b Hankuk Aviation University   (South Korea)

Author keywords

Additive; Electroplating; Pulse plating; SiP; Via filling

Indexed keywords

ADDITIVES; COPPER; DIFFUSION BARRIERS; ELECTROPLATING; SCANNING ELECTRON MICROSCOPY;

DRIE METHODS; HOLE FILLING; PULSE PLATING; SIP (SYSTEM IN PACKAGE);

FILLING;

EID: 35848939853     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-995-4.942     Document Type: Conference Paper

References (4)

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2. T.N. Theis, IBM J. Res. Dev., 44, 379 (2000)
3. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkins, and H. Deligianni, IBM J Res. Dev., 42, 567 (1998)
4. R. D. Mikkola, Q.-T. Jiang, and B. Carpenter, Plat. Surf. Finish., 87, 81 (2000)