Measuring the through-plane elastic modulus of thin polymer films in situ

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 1983-1988

  van Soestbergen, M ^a   Ernst, L J ^a   Jansen, K M B ^a   van Driel, W D ^a,b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC FILMS; ELASTIC MODULI; FAILURE ANALYSIS; FILM THICKNESS; HYDROSTATIC PRESSURE; PERMITTIVITY; SILICON WAFERS; THIN FILMS;

INTERDIGITATED ELECTRODE (IDE); REFERENCE MEASUREMENT; SILICON OXIDE DIELECTRIC LAYERS; THROUGH-PLANE ELASTIC MODULUS;

POLYMER FILMS;

EID: 35548965952     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.04.006     Document Type: Article

References (10)

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