Microstructure and properties of high speed jet electrodeposition nanocomposite coatings

Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment

Volumn 28, Issue SUPPL., 2007, Pages 243-248

  Wang, Wei ^a   Qian, Shi Qiang ^a   Zhou, Xi Ying ^a   Lin, Wen Song ^a  

^a SHANGHAI UNIVERSITY OF ENGINEERING SCIENCE   (China)

Author keywords

Bonding strength; Corrosion resistance; Deposition rate; High speed jet electrodeposition; Nano PTFE

Indexed keywords

BOND STRENGTH (MATERIALS); CORROSION RESISTANCE; CURRENT DENSITY; DEPOSITION RATES; ELECTRODEPOSITION; MICROHARDNESS; MICROSTRUCTURE; NICKEL; POLYTETRAFLUOROETHYLENES;

BONDING STRENGTH; THERMAL SHOCK TEST;

COMPOSITE COATINGS;

EID: 35348980788     PISSN: 10096264     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. H Takeuchi, S Tamura, Y Tsunekawa, et al. Application of Electrolyte Jet to Rapid Composite Electroplating[J]. Surface Engineering, 2004, 20(1): 25-30.
2. Gu Z H, Fahidy T Z. Rapid Production of High Aspect Ratio Copper Wires via Nonsubtnerged Anodic Jets Impinging on Cathode Substrates[J]. Journal of the Electrochemical Society, 2003, 150(11): 794-797.
3. Tzanavaras A, Young G, Gleixner S. The Grain Size and Microstructure of Jet-Electroplated Damascene Copper Films[J]. Journal of the Electrochemical Society, 2005, 152(2): 101-107.
4. Doryll J K, Haynes R. Thermocompression Bonding Using High-Speed Selective Gold Plating[J]. Plating and Surface Finish, 1980, 5: 81-85.