Rapid production of high aspect ratio copper wires via nonsubmerged anodic jets impinging on cathode substrates

Journal of the Electrochemical Society

Volumn 150, Issue 11, 2003, Pages

  Gu, Z H ^a   Fahidy, T Z ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CATHODES; ELECTROPLATING; NOZZLES; POROSITY; SUBSTRATES; SURFACE TREATMENT; WIRE;

CATHODE SUBSTRATES; COPPER WIRES; JET IMPINGING; NOZZLE ANODE;

ELECTROCHEMISTRY;

EID: 0242677663     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1617304     Document Type: Article

References (28)

1. M. Datta, IBM J. Res. Dev., 42, 563 (1998).
2. M. S. Sander, A. L. Prieto, R. Gronsky, T. Sands, and A. M. Stacy, Adv. Mater. (Weinheim, Ger.), 14, 665 (2002).
3. D. C. Edelstein, in Technical Digest for VLSI Symposium, IEEE, p. 301 (1995).
4. J. Mii, IBM J. Res. Dev., 39, 383 (1995).
5. T. A. Chase, U.S. Pat. 6,500,348 (2002).
6. W. Wang, U.S. Pat. 6,503,375 (2003).
7. F. G. Tseng and C. S. Yu, Sens. Actuators A, 97, 764 (2002).
8. M. Madou, Fundamentals of Microfabrication: the Science of Miniacturization, CRC Press, Boca Rata, FL (2002).
9. W. Ehrfeld, P. Bley, F. Gotz, and P. Hagmann, in Proceedings of IEEE Microrobot and Teleoperators Workshop (1987).
10. S. Tao, Z. H. Gu, and A. Nathan, J. Vac. Sci. Technol. A, 20, 1091 (2002).
11. H. Lorenz, M. Despont, P. Vettiger, and P. Reynaud, Microsyst. Technol., 4, 143 (1998).
12. G. W. Hsieh, Y. S. Hsieh, C. R. Yang, and Y. D. Lee, Microsyst. Technol., 8, 326 (2002).
13. P. Schmuki, L. E. Erickson, and G. Champion, J. Electrochem. Soc., 148, C177 (2001).
14. Z. H. Gu, V. Grishko, T. Z. Fahidy and W. W. Duley, in Proceedings of ICA-LEO'2000, Laser Microfabrication, Laser Institute of America, Vol. 90, p. D75 (2000).
15. S. Z. Chu, M. Sakairi, H. Takahashi, K. Simmammura, and Y. Abe, J. Electrochem. Soc., 147, 586 (2000).
16. E. M. El-Giar, R. A. Said, G. E. Bgiges, and D. J. Thomson, J. Electrochem. Soc., 147, 2181 (2000).
17. R. C. Alkire and T. J. Chen, J. Electrochem. Soc., 129, 2424 (1982).
18. D. J. Chin and C. H. Tsang, J. Electrochem. Soc., 125, 1461 (1978).
19. H. Takeuchi, Y. Tsunekawa, M. Okumiya, and Y. Kawai, J. Jpn. Inst. Met., 62, 377 (1998).
20. B. L. Smith and A. Glezer, J. Fluid Mech., 458, 1 (2002).
21. R. E. Sioda and R. B. Keating, Flow Electrolysis with Extended-Surface Electrodes in Electroanalytical Chemistry, A. J. Bard, Editor, Vol. 12, p. 1, Marcel Dekker, New York (1982).
22. N. A. Hampson and A. J. S. McNeil, The Electrochemistry of Porous Electrodes: Flow-through and Three Phase Electrodes, Vol. 9, Chap. 1, p. 1, The Chemical Society of London, London (1984).
23. R. E. Sioda and T. Z. Fahidy, Electrochim. Acta, 33, 719 (1988).
24. L. J. Durney, Electroplating Engineering Handbook, 4th ed., L. J. Durney, Editor, p. 253, Van Nostrand Reinhold, New York (1984).
25. D. T. Chin and K. L. Hsueh, Electrochim. Acta, 31, 561 (1986).
26. E. J. Fenech and C. W. Tobias, Electrochim. Acta, 2, 311 (1960).
27. L. H. Van Vleck, Elements of Material Sciences and Engineering, 4th ed., Chap. 13, Addison-Wesley Publishing, Reading, MA (1979).
28. Z. H. Gu and T. Z. Fahidy, J. Electrochem. Soc., 150, C24 (2003).