Development and evaluation of photodefined elements for microwave modules in LTCC for space applications

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 146-151

  Perrone, R ^a   Thust, H ^a   Rentsch, S ^a   Trabert, J ^a   Hein, M ^a   Muller J ^b  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b MSE Micro Systems Engineering GmbH & Co   (Germany)

Author keywords

Fine line; LTCC; Microwave applications; Microwave packages; Photoimageable inks

Indexed keywords

BANDWIDTH; MICROELECTRONICS; MICROWAVES; PACKAGING; SATELLITE COMMUNICATION SYSTEMS; SPACE APPLICATIONS;

FINE LINE; LTCC; MANUFACTURED STRUCTURES; MICROWAVE APPLICATIONS; PHOTOIMAGEABLE INKS; SATELLITE APPLICATIONS; SATELLITE COMMUNICATIONS; SIMULATIONS AND MEASUREMENTS;

MICROWAVE CIRCUITS;

EID: 85082166900     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. R. Perrone, H. Thust, K.-H. Drüe: Progress in the Integration of planar and 3D Coils on LTCC by using photoimageable Inks, 37th International Symposium on Microelectronics, Long Beach, November 14-18, 2004.
2. st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, April 10-13, 2005, Baltimore, Maryland USA.
3. G. Reppe et al.: Development and Evaluation of Fine Line Structuring Methods for Microwave Packages in Satellite Applications, 15th European Microelectronics and Packaging Conference & Exhibition, June 12-15, 2005, Oud Sint Jan, Brugge, Belgium.