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Volumn , Issue , 2007, Pages 2017-2023

Design of on-chip microchannel fluidic cooling structures

Author keywords

[No Author keywords available]

Indexed keywords

COMSOL MULTIPHYSICS; HEAT SOURCES; MICROCHANNEL FLUIDIC COOLING STRUCTURES;

EID: 35348927753     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374079     Document Type: Conference Paper
Times cited : (7)

References (15)
  • 1
    • 35348815211 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors, 2005 Edition.
    • International Technology Roadmap for Semiconductors, 2005 Edition.
  • 5
    • 8744298193 scopus 로고    scopus 로고
    • Stacked microchannel heat sinks for liquid cooling of microelectronic components
    • March
    • X. Wei and Y. Joshi, "Stacked microchannel heat sinks for liquid cooling of microelectronic components," Transactions of ASME, vol. 126, March 2004.
    • (2004) Transactions of ASME , vol.126
    • Wei, X.1    Joshi, Y.2
  • 6
  • 7
    • 0344348979 scopus 로고    scopus 로고
    • Analysis of two layered micro-channel heat sink concept in electronic cooling
    • Vafai, K. and Lu, Z., "Analysis of two layered micro-channel heat sink concept in electronic cooling", International Journal of Heat and Mass Transfer, Vol. 42 (1999), pp. 2287-2297.
    • (1999) International Journal of Heat and Mass Transfer , vol.42 , pp. 2287-2297
    • Vafai, K.1    Lu, Z.2
  • 8
    • 0036776505 scopus 로고    scopus 로고
    • Optimization of single and double layer counter flow micro-channel heat sink
    • Chong, S.H., Ooi, K.T., and Wong, T.N., "Optimization of single and double layer counter flow micro-channel heat sink", Applied Thermal Engineering, Vol. 22 (2002), pp 1569-1585.
    • (2002) Applied Thermal Engineering , vol.22 , pp. 1569-1585
    • Chong, S.H.1    Ooi, K.T.2    Wong, T.N.3
  • 9
    • 0023041689 scopus 로고
    • Optimal structure for micro-grooved cooling fin for high-power LSI devices
    • S. Sasaki and T. Kishimoto, "Optimal structure for micro-grooved cooling fin for high-power LSI devices," Electronics Letters, vol. 22, no. 25, pp. 1332-1334, 1986.
    • (1986) Electronics Letters , vol.22 , Issue.25 , pp. 1332-1334
    • Sasaki, S.1    Kishimoto, T.2
  • 12
    • 84858359400 scopus 로고    scopus 로고
    • http://www.geek.com/procspec/newsletter/nlproc02142001.html
  • 15
    • 0033337616 scopus 로고    scopus 로고
    • Phase change in microchannel heat sinks with integrated temperature sensors
    • December
    • L. Jiang and M. Wong, et al., "Phase change in microchannel heat sinks with integrated temperature sensors," Journal of Microelectromechanical Systems, vol. 8, No. 4, December 1999.
    • (1999) Journal of Microelectromechanical Systems , vol.8 , Issue.4
    • Jiang, L.1    Wong, M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.