Thermal design and optimization of a microchannel cooled integrated power electronic module

Collection of Technical Papers - 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference Proceedings

Volumn 3, Issue , 2006, Pages 2031-2037

  Mital, Manu ^a,b   Zhao, M Y ^a,c   Scott, E P ^a,d   Huang, Rena ^a,c  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b Virginia Polytechnic Institute and State University   (United States)

^c RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^d Virginia Tech Wake Forest School of Biomedical Engineering and Sciences   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDED POWER TECHNOLOGY; HEAT GENERATING CHIPS; INTEGRATED POWER ELECTRONIC MODULE; RECTANGULAR MICROCNANNELS;

COOLING SYSTEMS; FINITE ELEMENT METHOD; HEAT TRANSFER; INSULATED GATE BIPOLAR TRANSISTORS; LAMINAR FLOW; OPTIMIZATION; THERMAL EFFECTS;

POWER ELECTRONICS;

EID: 33845536008     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. D. B. Tuckerman and R. F. W. Pease, "High-performance heat sinking for VLSI," IEEE Electron Device Letter, vol. EDL-2, No. 5, May 1981
2. Y.F. Pang, E.P. Scott, J.D. van Wyk and Z.X. Liang, "Assessment of Some Integrated Cooling Mechanisms for an Active IPEM," ASME International Mechanical Engineering Congress and Exposition (IMECE), 2004, paper # 59342
3. S. I. Mueller, G. F. Nellis and T. Jahns, "Model and design of an air-cooled thermal management system for an integrated motor-controller," pp. 145-152, 2005 CPES Power Electric Electronics conference proceedings.