Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 815-820

  Oo, Zaw Zaw ^a   Liu, En Xiao ^a   Wei, XingChang ^a   Choon, Mark Tan Yew ^a   Li, Er Ping ^a   Zhang, Yaojiang ^b   Li, Le Wei ^c  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; NETWORKS (CIRCUITS);

MULTILAYERED PACKAGE STRUCTURE; SCATTERING MATRIX METHOD (SMM); SIGNAL TRACES;

MATRIX ALGEBRA;

EID: 35348920599     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373892     Document Type: Conference Paper

References (17)

1. nd Edt, 1997.
2. E. E. Davidson, "Electrical Design of A High Speed Computer Package," IBM J. Research and Development, Vol. 26, No. 3 (1982), pp. 349-361.
3. B. Young, Digital Signal Integrity. Englewood Cliffs, N.J.: Prentice Hall, 2001.
4. G.-T. Lei, R. W. Techentin, and B. K. Gilbert, "High-frequency characterization of power/ground plane structures," IEEE Trans. Microwave Theory & Tech., Vol. 47, No. 5 (1999), pp. 562-569.
5. W. Shi and J. Fang, "New efficient method of modeling electronics packages with layered power/ground planes," IEEE Trans. Advanced Packaging, Vol. 25, No. 3 (2002), pp. 417-423.
6. M. Leone, "The radiation of a rectangular power-bus structure at multiple cavity-mode resonances", IEEE Trans. Electromag. Compa., Vol. 45, No. 3 (2003), pp. 486-492.
7. R. L. Chen, J. Chen, T. H. Hubing, and W. Shi, "Analytical model for the rectangular power-ground structure including radiation loss," IEEE Trans. Electromag. Compat., Vol. 47, No. 1 (2005), pp. 10-16.
8. T. Wang, R. F. Harrington, and J. R. Mautz, "Quasi-static analysis of a microstrip via through a hole in a ground plane," IEEE Trans. Microwave Theory & Tech., Vol. 36, No.6(1988), pp. 1008-1013.
9. S.-G. Hsu and R.-B. Wu, "Full-wave characterization of a through hole via in multi-layered packaging," IEEE Trans. Microwave Theory & Tech., Vol. 43, No. 5 (1995), pp. 1073-1081.
10. B. Archambeault, C. Brench, and O. M. Ramahi, EMI/ EMC computational modeling handbook. Norwell, Kluwer Academic, MA, 1998.
11. I.E.-X. Liu, E.-P. Li, and L.-W. Li, "FDTD-macromodeling technique for simulation of electromagnetic interference at high speed interconnects", IEEE Trans, on Magnetics, Vol. 41, No. 1 (2005), pp. 65-71.
12. E.-X. Liu, E.-P. Li, and L.-W. Li, "Analysis of multilayer planner circuits by a hybrid method", IEEE Microwave and Wireless Components Letters, Vol. 16, No. 2 (2006), pp. 66-68.
13. E.-X. Liu, Zaw Z. O., and E.-P. Li, "Analysis of rectangular power/ground plane pairs for noise suppression," Proc. on Electronics Systemintegration Technology Conference, Sept. 2006, Dresden, Germany.
14. L. Tsang, J. A. Kong, K. H. Ding, and C. Ao, Scattering of Electromagnetic Waves: Numerical Simulations, Wiley Interscience, New York, 2001.
15. C. A. Balanis, Advanced Engineering Electromagnetics. John Wiley & Sons, Inc., New York, 1989.
16. W. C. Chew, Waves and Fields In Inhomogeneous Media. Van Nostrand Reinhold, New York, 1990.
17. H. Xu, D. R. Jackson, and J. T. Williams, "Comparison of models for the probe inductance for a parallel-plate waveguide and a microstrip patch," IEEE Trans. Antennas and Propagation, Vol. 53, No. 10 (2005), pp. 3229-3235.