Analysis of rectangular power-ground plane pairs for noise suppression

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 241-246

  Liu, Enxiao ^a   Oo, Zaw Zaw ^a   Li, ErPing ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMPEDANCE MEASUREMENT; ELECTRONIC STRUCTURE; ELECTRONICS PACKAGING; NUMERICAL METHODS; PRINTED CIRCUIT BOARDS;

EDGE RADIATION; HIGH-SPEED PACKAGES; NOISE SUPPRESSION; RECTANGULAR POWER-GROUND PLANES;

NOISE ABATEMENT;

EID: 42549171872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280004     Document Type: Conference Paper

References (11)

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