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Volumn , Issue , 2007, Pages 244-253

Architectural implications of brick and mortar silicon manufacturing

Author keywords

Chip assembly; Design re use; Interconnect design

Indexed keywords

CHIP ASSEMBLY; DESIGN RE-USE; INTERCONNECT DESIGN;

EID: 35348911869     PISSN: 10636897     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1250662.1250693     Document Type: Conference Paper
Times cited : (11)

References (59)
  • 4
    • 84858363378 scopus 로고    scopus 로고
    • Ambric, Inc. website
    • Ambric, Inc. website, www.ambric.com.
  • 10
    • 0015206785 scopus 로고
    • On a pin versus block relationship for partitions of logic graphs
    • R. R. B.S. Landman. On a pin versus block relationship for partitions of logic graphs. Transactions on Computers, 1971.
    • (1971) Transactions on Computers
    • Landman, R.R.B.S.1
  • 14
    • 84858353235 scopus 로고    scopus 로고
    • Cradle technologies website
    • Cradle technologies website, www.cradle.com.
  • 17
    • 35348875877 scopus 로고    scopus 로고
    • eASIC website, www.easic.com.
    • eASIC website, www.easic.com.
  • 19
    • 35348846371 scopus 로고    scopus 로고
    • J. U. K. et. al. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. 49, 2005.
    • J. U. K. et. al. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. 49, 2005.
  • 20
    • 35348876477 scopus 로고    scopus 로고
    • K. K. et al. 1.27gb/s/pin 3mw/pin wireless superconnect (wsc) interface scheme. 2003.
    • K. K. et al. 1.27gb/s/pin 3mw/pin wireless superconnect (wsc) interface scheme. 2003.
  • 25
    • 84924991730 scopus 로고    scopus 로고
    • M. Heskins and J. Guillet. Solution properties of poly(N- isopropylacrylamide). A2:1441, 1968.
    • M. Heskins and J. Guillet. Solution properties of poly(N- isopropylacrylamide). A2:1441, 1968.
  • 30
    • 84858345573 scopus 로고    scopus 로고
    • Mathstar, Inc. website
    • Mathstar, Inc. website, www.mathstar.com.
  • 37
    • 35348877076 scopus 로고    scopus 로고
    • picochip website, www.picochip.com.
    • picochip website, www.picochip.com.
  • 39
    • 3042669130 scopus 로고    scopus 로고
    • Power5 chip: A dual-core multithreaded processor
    • Mar-Apr
    • J. T. R. Kalla, Sinharoy Balaram. IBM Power5 chip: a dual-core multithreaded processor. Micro, Mar-Apr 2004.
    • (2004) Micro
    • Kalla, J.T.R.1    Sinharoy Balaram, I.B.M.2
  • 42
    • 35348827186 scopus 로고    scopus 로고
    • D. Saltzman and J. Knight, T. Capacitive coupling solves the known good die problem. 1994.
    • D. Saltzman and J. Knight, T. Capacitive coupling solves the known good die problem. 1994.
  • 46
    • 84858353229 scopus 로고    scopus 로고
    • http://www-vlsi.stanford.edu/ee272/proj99/babyviterbi/verilogcode.html.
  • 47
    • 84858348998 scopus 로고    scopus 로고
    • Sun ultrasparc-t1. http://www.sun.com/processors/UltraSPARC-T1/.
    • Sun ultrasparc-t1
  • 51
    • 8344251916 scopus 로고    scopus 로고
    • Deterministic memory-efficient string matching algorithms for intrusion detection
    • N. Tuck, T. Sherwood, B. Calder, and G. Varghese. Deterministic memory-efficient string matching algorithms for intrusion detection. In Infocom Conference, 2004.
    • (2004) Infocom Conference
    • Tuck, N.1    Sherwood, T.2    Calder, B.3    Varghese, G.4
  • 56
    • 0032638328 scopus 로고    scopus 로고
    • Z. Yang, K.-T. Cheng, and K. Tai. A new bare die test methodology. VLSI Test Symposium, 00, 1999.
    • Z. Yang, K.-T. Cheng, and K. Tai. A new bare die test methodology. VLSI Test Symposium, 00, 1999.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.