Development of Sn-Cu bumping by alloying Cu/Sn metal stacks

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 1035-1042

  Higuchi, Kazuhito ^a   Seto, Masaharu ^a   Uchida, Masayuki ^a   Togasaki, Takashi ^a   Ezawa, Hirokazu ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Bump; Intermetallic compounds; Sn Cu solder; Stack plating; Ubm

Indexed keywords

BUMP; ENVIRONMENTAL POLLUTIONS; EUTECTIC COMPOSITION; HIGH TEMPERATURE STORAGE; HIGH-VOLUME PRODUCTION; SN-CU SOLDERS; UBM; UNDER-BUMP METALLURGIES;

ALLOYING; COPPER ALLOYS; COPPER COMPOUNDS; INTERMETALLICS; MICROELECTRONICS; NICKEL; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 35348830725     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. H. Ezawa, M. Miyata, S. Honma, H. Inoue, T. Tokuoka, J. oshioka, and M. Tsujimura, "Eutectic Sn-Ag Solder Bump Process for ULSI Flip Chip Technology", IEEE Transaction of Electronics Packaging Manufacturing, Vol. 24, No. 4. pp. 275-281, 2001.
2. H. Ezawa, M. Miyata, M. Seto, and S. Honma, "Pb-Free Bumping by Alloying Electroplated Metal Stacks", Proceedings of Electronic Components and Technology Conference (ECTC), pp. 664-667, 2003.
3. H. Ezawa, M. Seto, and H. Katsumata, "Pb-Free Bumping for High-Performance SoCs", Proceedings of Electronic Components and Technology Conference (ECTC), pp. 655-660, 2004.
4. S. Chada, R. A. Fournelle, W. Laub, and D. Shangguan, "Copper Substrate Dissolution in Eutectic Sn-Ag Solder and Its Effect on Microstructure", Journal of Electronic Materials, Vol. 29, No. 10, pp. 1214-1221, 2000.