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Volumn 6519, Issue PART 1, 2007, Pages

Adapting immersion exposure to mass production by adopting a cluster of novel resist-coating/developing and immersion-exposure equipment

Author keywords

CD uniformity; Defect; Immersion lithography

Indexed keywords

DEFECTS; DEIONIZED WATER; DIMENSIONAL STABILITY; MOISTURE; SEMICONDUCTOR DEVICES; SURFACE ACTIVE AGENTS;

EID: 35148901150     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.711853     Document Type: Conference Paper
Times cited : (5)

References (7)
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    • 33745789198 scopus 로고    scopus 로고
    • T.Fujiwara, K.Shiraishi, H.Tanizaki, Yuuki Ishii, H.Kyoda, T.Yamamoto, S.Ishida, Wafer Management between Coat/Developer Track and Immersion Lithography Tool Proc. SPIE 6154, pp. 61544L-1- 61544L-10 .2006.
    • T.Fujiwara, K.Shiraishi, H.Tanizaki, Yuuki Ishii, H.Kyoda, T.Yamamoto, S.Ishida, "Wafer Management between Coat/Developer Track and Immersion Lithography Tool" Proc. SPIE 6154, pp. 61544L-1- 61544L-10 .2006.
  • 2
    • 85069097796 scopus 로고    scopus 로고
    • H.Namatsu, K.Kurihara, M.Nagase, K.Iwadate, and K.Murase., Proc. Appl. Phys. Letter. 66 (20), 15 pp.2655-2657 (1995)
    • H.Namatsu, K.Kurihara, M.Nagase, K.Iwadate, and K.Murase., Proc. Appl. Phys. Letter. 66 (20), 15 pp.2655-2657 (1995)
  • 3
    • 3843149311 scopus 로고    scopus 로고
    • Improvement of pattern collapse issue by additive added D.I water rinse process 2
    • O.miyahara, K.Tanaka, S.Wakamizu, J.Kitano, Y.Yamada, "Improvement of pattern collapse issue by additive added D.I water rinse process 2" Proc. SPIE 5376, pp. 830-841 .2004.
    • (2004) Proc. SPIE , vol.5376 , pp. 830-841
    • miyahara, O.1    Tanaka, K.2    Wakamizu, S.3    Kitano, J.4    Yamada, Y.5
  • 4
    • 0141722561 scopus 로고    scopus 로고
    • Improvement of pattern collapse issue by additive added D.I water rinse process
    • K.Tanaka et. al., "Improvement of pattern collapse issue by additive added D.I water rinse process,Proc" SPIE 5039,pp1366-1381 (2003)
    • (2003) Proc SPIE , vol.5039 , pp. 1366-1381
    • Tanaka, K.1    et., al.2
  • 5
    • 33745591422 scopus 로고    scopus 로고
    • M.Enomoto, S.Hatakeyama, T.Niwa, T.Tomita, H.Kyoda, J.Kitano, S.Shimura and T. Kawasaki, 193nm Immersion process Defect Generation and Reduction Mechanism Investigation using analytical methods Proc. SPIE 6153, pp. 61533L-1 - 61533L-10 .2006.
    • M.Enomoto, S.Hatakeyama, T.Niwa, T.Tomita, H.Kyoda, J.Kitano, S.Shimura and T. Kawasaki, "193nm Immersion process Defect Generation and Reduction Mechanism Investigation using analytical methods" Proc. SPIE 6153, pp. 61533L-1 - 61533L-10 .2006.
  • 6
    • 33745618720 scopus 로고    scopus 로고
    • T.Tomita, T.Shimoaoki, M.Enomoto, H.Kyoda, J.Kitano and T.Suganaga, An Investigation on Defect-generation Conditions in Immersion Lithography Proc. SPIE 6153, pp. 61533M-1- 61533M-12 .2006.
    • T.Tomita, T.Shimoaoki, M.Enomoto, H.Kyoda, J.Kitano and T.Suganaga, "An Investigation on Defect-generation Conditions in Immersion Lithography" Proc. SPIE 6153, pp. 61533M-1- 61533M-12 .2006.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.