Wafer management between coat/developer track and immersion lithography tool

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6154 III, Issue , 2006, Pages

  Fujiwara, Tomoharu ^a   Shiraishi, Kenichi ^a   Tanizaki, Hirokazu ^a   Ishii, Yuuki ^a   Kyoda, Hideharu ^b   Yamamoto, Taro ^b   Ishida, Seiki ^b  

^a NIKON CORPORATION   (Japan)

^b TOKYO ELECTRON LTD   (Japan)

Author keywords

Coat developer; Immersion lithography; Post rinse; Pre rinse; Watermark

Indexed keywords

CONTAMINATION; DIGITAL WATERMARKING; LITHOGRAPHY; NOZZLES; SCANNING;

COAT/DEVELOPER; IMMERSION LITHOGRAPHY; POST RINSE; PRE RINSE; WATERMARK;

SILICON WAFERS;

EID: 33745789198     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.656303     Document Type: Conference Paper

References (3)

1. Burn J. Lin, "Immersion lithography and its impact on semiconductor manufacturing", Journal of Microlithography, Microfabrication, and Microsystems, 3, (533), 2004.
2. Soichi Owa, Hiroyuki Nagasaka, Yuuki Ishii, Kenichi Shiraishi and Shigeru Hirukawa, "Full-field exposure tools for immersion lithography", Proc. SPIE 5754, pp. 655-668 (2005).
3. Katsushi Nakano, Shirou Nagaoka and Soichi Owa, "Defectivity data taken with a full-field immersion exposure tool", CD-ROM of the 2nd International Symposium on Immersion Lithography, held in Bruges (IMEC, International SEMATECH, Selete), September (2005).