Effect of novel rinsing material and surfactant treatment on the resist pattern performance

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6519, Issue PART 2, 2007, Pages

  Huang, Victor ^a   Chiu, C C ^a   Lin, C A ^a   Chang, Ching Yu ^a   Gau, T S ^a   Lin, Burn J ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

CER; Immersion resist; Line width roughness; Pattern collapse; Rinse; Surfactant

Indexed keywords

SHRINKAGE; SURFACE ACTIVE AGENTS; SURFACE ROUGHNESS; WATER;

IMMERSION RESIST; LINE WIDTH ROUGHNESS; PATTERN COLLAPSE; RINSE; SURFACTANT;

AUTOMATIC TEST PATTERN GENERATION;

EID: 35148870623     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.713051     Document Type: Conference Paper

References (5)

1. Keiichi Tanaka, Ryoichiro Naito, Tomohiro Kitada, Yukio Kida, Yashiaki Yamada, Masakazu Kobayashi, and Hiroyuki Ichikawa; Proc. SPIE, 5039, p. 1366 (2003).
2. Peng Zhang, Manuel Jaramillo Jr., Madhukar B. Rao, Colin Yates, Danielle M. King, Brenda F. Ross, Bridget L.O'Brien; Proc. SPIE, 5376, p. 801 (2004).
3. Ching Yu Chang, D.C Yu, J.H. Chen, John C.H. Lin, Burn J. Lin; Proc. SPIE, 6153, p. 61530M (2006).
4. Ivan Junarsa, Mark P. Stoykovich, Kenji Yoshimoto, Pual F. Nealey; Proc. SPIE, 5376, p. 842 (2004).
5. Stefan Hien, Georgia Rich, Gilbert Molina, Heidi B. Cao, Pual F. Nealey; Proc. SPIE, 4690, p. 254 (2002).