Copper nanowires and silver micropit arrays from the electrochemical treatment of a directionally solidified silver-copper eutectic

Electrochimica Acta

Volumn 53, Issue 2, 2007, Pages 324-329

  Brittman, Sarah ^a,b   Smith, Andrew Jonathan ^a   Milenkovic, Srdjan ^a   Hassel, Achim Walter ^a  

^a MAX PLANCK INSTITUT FÜR EISENFORSCHUNG GMBH   (Germany)

^b HARVARD UNIVERSITY   (United States)

Author keywords

Copper Nanowires; Directional solidification; Micropit; Silver copper eutectic

Indexed keywords

COPPER ALLOYS; ELECTROCHEMISTRY; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; VOLUME FRACTION;

COPPER NANOWIRES; MICROPIT; SILVER MICROPIT ARRAYS; SILVER-COPPER EUTECTICS;

NANOWIRES;

EID: 35148817008     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.07.048     Document Type: Article

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