Curing behavior of epoxy resin initiated by amine-containing inclusion complexes

Polymer Journal

Volumn 39, Issue 8, 2007, Pages 845-852

  Amanokura, Natsuki ^a,b   Kaneko, Masami ^b   Sahara, Tetsuya ^b   Sato, Ryu ^a  

^a IWATE UNIVERSITY   (Japan)

^b NIPPON SODA CO LTD   (Japan)

Author keywords

1,1,2,2 tetrakis(4 hydroxyphenyl) ethane; Amine containing inclusion complex; Curing acceleration; Epoxy resin; Hardener; Hydrogen bond; Pot life

Indexed keywords

AMINES; CRYSTALS; CURING; ETHANE; HYDROGEN BONDS; X RAY CRYSTALLOGRAPHY;

CURING ACCELERATIONS; GUEST MOLECULES; HARDNERS; IMIDAZOLE MOLECULES; POT LIFE EXTENSIONS;

EPOXY RESINS;

EID: 34948879084     PISSN: 00323896     EISSN: 13490540     Source Type: Journal    
DOI: 10.1295/polymj.PJ2006224     Document Type: Article

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