A PTH reliability model considering barrel stress distributions and multiple PTHS in a PWB

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2006, Pages 256-265

  Xie, Jingsong ^a   Kang, Rui ^a   Zhang, Yuan ^b   Guo, Gordon ^b  

^a BEIHANG UNIVERSITY   (China)

^b HUAWEI TECHNOLOGIES CO LTD   (China)

Author keywords

Fatigue; Plated through holes; Printed wiring board; Reliability; Stress distribution

Indexed keywords

EID: 34250752799     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2006.251225     Document Type: Conference Paper

References (9)

1. IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards, IPC Technical Report, September 1988
2. Werner Engelmaier, IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study, IPC Technical Report, April 1986
3. Bhandarkar S. M., Dasgupta A., Barker D., Pecht M. and Engelmaier W., "Influence of Selected Design Variables on Thermo-mechanical Stress Distributions in Plated-Through-Hole Structures," Transaction of the ASME Journal of Electronic Packaging, Vol. 114, March 1992, pp.8-13
4. Mirman B.A., "Mathematical model of a plated-through hole under a load induced by thermal mismatch," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.11 (4), Dec. 1988, pp.506-511
5. Iannuzzelli R., "Predicting plated-through-hole reliability in high temperature manufacturing processes," Proceedings of the 41st Electronic Components and Technology Conference, 11-16 May 1991, pp.410-421
6. Chia-Yu Fu, David L. McDowell and I. Charles Urne, "Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes during Wave Soldering," Journal of Electronic Packaging, Vol.124, March 2002, pp.45-53
7. Barker D., Pecht M., Dasgupta A. and Naqvi S., "Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering," ASME Journal of Electronic Packaging, Vol.113 (2), June 1991, pp.149-155
8. A. Dasgupta, "Failure-Mechanism Model for Cyclic Fatigue," IEEE Trans. on Reliability, vol.42, March 1993, pp.548-555
9. B. Sun, J. Xie and R. Kang, "An Improved Stress Distribution Model for Plated Through Holes (in Chinese)," Proceedings of the 11th National Symposium on Reliability Physics, WenZhou, Zhejiang, China, October 21-25, 2005, pp.102-111