The development of an innovative process of large grained and low resistivity Cu wires for less than hp 45nm ULSI

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 46-48

  Tashiro, Suguru ^a   Khoo, Khyoupin ^a   Nagano, Takahiro ^a   Onuki, Jin ^a   Chonan, Yasunori ^b   Akahoshi, Haruo ^c   Tobita, Toshimi ^c   Chiba, Masahiro ^c   Ishikawa, Kensuke ^c   Ishikawa, Nobuhiro ^d  

^a IBARAKI UNIVERSITY   (Japan)

^b AKITA PREFECTURAL UNIVERSITY   (Japan)

^c HITACHI LTD   (Japan)

^d NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; ELECTRIC CONDUCTIVITY; ELECTRIC CONNECTORS; ULSI CIRCUITS;

HIGH PURITY PROCESS; IMPURITY CONCENTRATION; INNOVATIVE PROCESS; LOW RESISTIVITY CU WIRES;

ELECTRIC WIRE;

EID: 34748923686     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382337     Document Type: Conference Paper

References (6)

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5. K. P. KHOO, Jin ONUKI, Takahiro Nagano, Yasunori Chonan, Haruo Akahoshi, Toshimi Tobita, Masahiro Chiba, Tatsuyuki Saito and Kensuke Ishikawa, Advanced Metallization Conference, p. 58, 2006.
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