Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2719-2722

  Delsol, R ^a   Chapelon, L ^b   Chaabouni, H ^b   Broussous, L ^b   Schellenberger, M ^c   Ostrovski, A ^b   Normandon, P ^b  

^a NXP SEMICONDUCTORS   (France)

^b STMICROELECTRONICS   (France)

^c FRAUNHOFER INSTITUTE FOR INTEGRATED SYSTEMS AND DEVICE TECHNOLOGY IISB   (Germany)

Author keywords

Low k; Pore sealing; RGA; ULK

Indexed keywords

DEPOSITION; HYDROPHILICITY; HYDROPHOBICITY;

PORE SEALING; RESIDUAL GAS ANALYSIS TECHNIQUE; SEMI-CONDUCTOR INDUSTRY; ULK DIELECTRICS;

DIELECTRIC MATERIALS;

EID: 34548853966     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.020     Document Type: Article

References (5)

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