Interface structure and mechanical performance of TLP bonded joints of Al2O3p/6061Al composites using Cu/Ni composite interlayers

Scripta Materialia

Volumn 51, Issue 2, 2004, Pages 147-150

  Yan, Jiuchun ^a   Xu, Zhiwu ^a   Wu, Gaohui ^a   Yang, Shiqin ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Cu Ni Cu interlayers; Diffusion bonding; Fracture; Interface structure; Particulate reinforced composites

Indexed keywords

BONDING; COMPOSITION; DIFFUSION; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE ANALYSIS; FRACTURE; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; X RAY DIFFRACTION ANALYSIS;

CU/NI/CU INTERLAYERS; DIFFUSION BONDING; INTERFACE STRUCTURE; PARTICULATE REINFORCED COMPOSITES;

METALLIC MATRIX COMPOSITES;

EID: 2442532575     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.03.036     Document Type: Article

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