An enhanced prognostic model for intermittent failures in digital electronics

IEEE Aerospace Conference Proceedings

Volumn , Issue , 2007, Pages

  Zhang, Guangfan ^a   Kwan, Chiman ^a   Xu, Roger ^a   Vichare, Nikhil ^b   Pecht, Michael ^b  

^a INTELLIGENT AUTOMATION INC   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; FAILURE ANALYSIS; SOLDERED JOINTS; STRUCTURAL HEALTH MONITORING; TECHNOLOGICAL FORECASTING; TEMPERATURE CONTROL; THERMAL LOAD;

INTERCONNECT FAILURES; TEMPERATURE CYCLING; UNCERTAINTY ADJUSTED PROGNOSTICS (UAP);

ELECTRONIC EQUIPMENT;

EID: 34548794728     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.2007.352884     Document Type: Conference Paper

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