The effect of plasma damage on the material composition and electrical performance of different generations of SiOC(H) low k films

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 259-264

  Humbert, Aurelie ^a   Badaroglu, Didem Ernur ^a   Hoofman, Romano J O M ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; CHEMICAL BONDS; DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN; MOISTURE; OPTICAL INTERCONNECTS; SILICON COMPOUNDS;

CHEMICAL DEGRADATION; INTERCONNECT INTEGRATION; LOW-K FILMS; POROUS SIOC MATERIAL;

PLASMA APPLICATIONS;

EID: 33749624604     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f04-03     Document Type: Conference Paper

References (6)

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6. J.Michelon, R.J.O.M Hoofman, EEE IIRW proceedings 2005