Failure modes on low voltage power MOSFETs under high temperature application

Microelectronics Reliability

Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1767-1772

  Dupont, L ^a   Lefebvre, S ^a   Bouaroudj, M ^b   Khatir, Z ^b   Faugieres J C ^a  

^a University of Paris Cité   (France)

^b INRETS LTN   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FAILURE ANALYSIS; HIGH TEMPERATURE APPLICATIONS; MOSFET DEVICES; POWER CONTROL; POWER CONVERTERS; THERMAL CYCLING;

HIGH CURRENT MODULES; HIGH TEMPERATURE CAPABILITY; POWER DEVICES;

ELECTRIC VEHICLES;

EID: 34548711305     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.066     Document Type: Article

References (7)

1. Matsumoto S. Advancement of hybrid vehicle technology. In: EPE conference, Dresden. 2005.
2. Marz M. Towards an integrated hybrid drive. In: ECPE - power electronics system integration seminar, Nuremberg. November 5, 2004.
3. Held M., et al. Fast power cycling test for insulated gate bipolar transistor modules in traction application. Int J Electron 86 10 (1999) 1193-1204
4. Ciappa M. Selected failure mechanisms of modern power modules. Micrelectron Reliab 42:653-67
5. Sankaran VA et al. Power cycling reliability of IGBT power modules. IEEE-IAS meeting, New Orleans, LA; 1997. p. 5-9.
6. Morozumi A., et al. Reliability of power cycling for IGBT power semiconductor modules. IEEE Trans Indus Appl 39 3 (2003)
7. Coquery, et al. High temperature reliability on automotive power modules verified by power cycling tests up to 150 °C. Microelectron Reliab 43 9-11 (2003) 871-1876