A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1668-1671

  Lee, K C ^a   Vythilingam, A ^a   Alpern, P ^b  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIE SURFACE; MOISTURE DIFFUSION; OPTIMAL BAKING; PRECONDITIONING;

CONCENTRATION (PROCESS); DELAMINATION; DIFFUSION; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; MOISTURE; SOLDERING; THERMAL CYCLING; THERMAL STRESS;

MICROPROCESSOR CHIPS;

EID: 24144452537     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.079     Document Type: Conference Paper

References (9)

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