A technique for fabricating uniform double-sided porous silicon wafers

Electrochemical and Solid-State Letters

Volumn 10, Issue 11, 2007, Pages 130-133

  James, T D ^a   Keating, A J ^b,c   Parish, G ^a   Faraone, L ^a   Musca, C A ^a  

^a Microelectronic Research Group   (Australia)

^b UNIVERSITY OF WESTERN AUSTRALIA   (Australia)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOMERS; ELECTRODES; FILM THICKNESS; MICROFABRICATION; POROUS SILICON; THICK FILMS;

EXPERIMENTAL CONDITIONS; POSTPROCESSING; REPRODUCIBILITY;

SILICON WAFERS;

EID: 34548491991     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2777007     Document Type: Article

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