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Volumn 52, Issue 8, 2000, Pages
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Solder alloys and soldering processes for flux-free soldering of difficult-to-wet materials
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM COPPER ALLOYS;
EUTECTICS;
FLUXES;
GRAIN GROWTH;
INTERFACES (MATERIALS);
METALLOGRAPHIC MICROSTRUCTURE;
SOLDERED JOINTS;
SOLDERING ALLOYS;
STEEL;
TIN ALLOYS;
WETTING;
ZINC ALLOYS;
DIFFICULT-TO-WET MATERIALS;
FLUX-FREE SOLDERING;
SOLDERING;
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EID: 0034245009
PISSN: 00367184
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (13)
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References (9)
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